Aluminum Copper Alloy Powder Product Specification
Aluminum copper alloy powder is a high-performance material that combines the lightweight and corrosion-resistant properties of aluminum with the high conductivity and strength of copper. This alloy is ideal for applications that require both strength and conductivity, such as in electrical components, heat exchangers, and structural parts. Aluminum copper alloy powder is commonly used in the automotive, aerospace, and electronics industries for its balance of mechanical properties and thermal/electrical conductivity.

Product Properties:
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Appearance: Light metallic powder with a slight copper tint
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Tapping Density: 3.90 g/cm³
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Apparent Density: 3.50 g/cm³
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Flowability: 25 s/50 g
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Size: 53-150 µm
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PSD:
D10 = 40.2 µm, D50 = 75.8 µm, D90 = 135.0 µm
Applications:
Aluminum copper alloy powder is primarily used in the automotive, aerospace, and electronics industries where high strength, conductivity, and corrosion resistance are required. Its applications include heat exchangers, electrical connectors, and components subjected to high thermal and mechanical stress. It is also used in powder metallurgy processes, including casting and additive manufacturing.
Key Features and Benefits:
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Lightweight: The high aluminum content ensures that the alloy remains lightweight, ideal for applications where weight is a critical factor.
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Corrosion Resistance: Aluminum provides excellent corrosion resistance, making the alloy suitable for use in harsh environments.
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High Electrical Conductivity: The copper content ensures that the alloy has good electrical conductivity, making it ideal for electrical components.
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Mechanical Strength: Copper’s strength and aluminum’s lightweight properties ensure that the alloy maintains its structural integrity even under stress.
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Versatility: Suitable for a variety of manufacturing processes, including powder metallurgy, casting, and additive manufacturing.
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Thermal Conductivity: The alloy has good thermal conductivity, making it suitable for use in heat exchangers and thermal management components.